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DTSTART;TZID=America/New_York:20171009T153000
DTEND;TZID=America/New_York:20171009T173000
DTSTAMP:20260306T063331
CREATED:20170920T183219Z
LAST-MODIFIED:20170926T171351Z
UID:4003-1507563000-1507570200@www.freedm.ncsu.edu
SUMMARY:iMaps PDC on Hetergeneous Packaging of Wide Band Gap Power Electronics
DESCRIPTION:Course description:\nWith the recent availability of essentially chip-scale packaged GaN and higher voltage SiC Wide Band Gap (WBG) power devices\, the onus is on packaging engineers to expand their understanding of the unprecedented high-speed and high-power-density characteristics of these devices and the impact on package design. The trend for the past several years has been to place the WBG devices in packages designed for Si\, but only to provide end users with familiar outlines. However\, the WBG devices have matured sufficiently to show that only high levels of package integration will allow the claimed higher WBG performances. \n\nUnderstanding critical operating characteristics of WBG power devices from the perspective needed by the packaging engineer.\nA review of gate driver circuits that operate at >10X frequency of the power stages\, and are integrated into devices and integrated through packaging.\nIntroduction to planar power GaN and on-chip functional integration.\nDeveloping design rules for packaging engineers and showing trends to multidisciplinary power electronics packaging\, and heterogeneous integration of power components and devices\, including quilt packaging.\nStep-by-step presentation of multiphysics modeling for design\, and use of Q3D for power circuit parameter extraction and design refinement.\nUse of case studies to support the above topic.\n\nRegister Online \nIMAPS’17-DCHopkins-PDC Announcement
URL:https://www.freedm.ncsu.edu/event/imaps-pdc-on-hetergeneous-packaging-of-wide-band-gap-power-electronics/
LOCATION:Raleigh Convention Center\, 500 South Salisbury Street\, Raleigh\, NC\, 27601\, United States
ATTACH;FMTTYPE=image/jpeg:https://www.freedm.ncsu.edu/wp-content/uploads/2017/09/IMAPS17-Header.jpg
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