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FREEDM Tech Webinar Series: A New Technique for HV Electric Field Analysis and E-Field Profiling in Layered Packaging
FREEDM Tech Webinar Series: A New Technique for HV Electric Field Analysis and E-Field Profiling in Layered Packaging
Power modules often fail at triple points where three materials come together and partial discharge can age the insulation. This presentation proposes a capacitive modeling method to reveal techniques to reduce the electric field intensity that were not previously obvious. […]