Henkel Corporation and FREEDM Systems Engineering Research Center today announced a new partnership agreement designed to study the impact of materials technology on power electronics applications. Henkel, well-known for its global presence in the chemical and consumer goods industries, has […]

Course description: With the recent availability of essentially chip-scale packaged GaN and higher voltage SiC Wide Band Gap (WBG) power devices, the onus is on packaging engineers to expand their understanding of the unprecedented high-speed and high-power-density characteristics of these […]