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International Symposium on 3D Power Electronics Integration and Manufacturing

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June 25 - June 27

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This symposium, to be held at the University of Maryland, College Park will bring together world-class experts representing a wide range of disciplinary perspectives to advance the development of future 3D power electronics systems.  The focus will be on additive, embedded, co-designed, and integrative packaging technologies and the symposium will emphasize the need to address mechanical, materials, reliability, and manufacturability issues in small, smart, power dense components and modules.

Details


Start
June 25
End
June 27
Website
http://www.3d-peim.org/
Location
Adele H. Stamp Student Union, University of Maryland, College Park, MD USA
MDUnited States
Website
http://www.3d-peim.org/
Organizer
Power Sources Manufacturers Association
Website
www.psma.com