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International Symposium on 3D Power Electronics Integration and Manufacturing
This event has passed.
June 25 - June 27
This symposium, to be held at the University of Maryland, College Park will bring together world-class experts representing a wide range of disciplinary perspectives to advance the development of future 3D power electronics systems. The focus will be on additive, embedded, co-designed, and integrative packaging technologies and the symposium will emphasize the need to address mechanical, materials, reliability, and manufacturability issues in small, smart, power dense components and modules.