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FREEDM Tech Webinar Series: A New Technique for HV Electric Field Analysis and E-Field Profiling in Layered Packaging

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December 15, 2021 | 11:00 AM - 12:00 PM

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Power modules often fail at triple points where three materials come together and partial discharge can age the insulation. This presentation proposes a capacitive modeling method to reveal techniques to reduce the electric field intensity that were not previously obvious. Accounting for both parallel plate capacitance and fringing field effects, the model is verified through analysis in Ansys Maxwell for multi-layered and heterogeneous substrate structures as well. The presenter is Sourish Sinha, a PhD student working with Dr. Doug Hopkins in the Packaging Research in Electronic Energy Systems (PREES) Lab.

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Date

December 15, 2021

Time
11:00 AM - 12:00 PM