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iMaps PDC on Hetergeneous Packaging of Wide Band Gap Power Electronics
iMaps PDC on Hetergeneous Packaging of Wide Band Gap Power Electronics
Course description: With the recent availability of essentially chip-scale packaged GaN and higher voltage SiC Wide Band Gap (WBG) power devices, the onus is on packaging engineers to expand their understanding of the unprecedented high-speed and high-power-density characteristics of these […]
$400