Professor Hopkins’ has over 20 years of experience in electronic energy systems. His early career was at the R&D centers of the General Electric and Carrier Air-Conditioning Companies in advanced power electronics systems for military and commercial applications up to the low MW range. Prior to joining NCSU, he was at the University at Buffalo (SUNY Buffalo) conducting research in high temperature power electronics (>350˚C) and packaging with aluminum-based composites. Professor Hopkins held visiting faculty appointments with the Army, NASA, and the Ohio Space Institute. He was co-founder of DensePower, LLC, and conducts expert witness activities through DCHopkins & Associates, LLC.
His primary research areas include very high frequency and high density power electronic systems, extreme environment electronics, organic-based circuits for power and energy systems, high temperature(>300˚C) metal-matrix composite packaging with integrated ceramics, and true 3D electronic packaging with flexible jet patterning. At NC State, he founded the Laboratory for Packaging Research in Electronic Energy Systems (PREES) which focuses on high-temperature, high-frequency, 3D packaging using composite materials primarily for wide band gap power semiconductors (e.g. GaN and SiC).